3
FLEX
Better reliability, signal integrity, noise reduction, and impedance control.
Reduces mechanical space and device weight.
Improves design freedom HDI microvia.
Cost-saving alternative to multi-layer FPC.
Full range of products: Single-Sided, Double-Sided & Multi-Layer board
Product Name
Min. Inner & Outer Layer Blind Hole 0.125mm
Min. Inner & Outer Layer Buried Hole 0.25mm
Min. Inner & Outer Layer Layer Line Width/spacing: 4/4mil
Layer Structure: 2+4+2
Imme Tin finishing
